Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
UR5123 is a polyurethane potting compound which has been formulated for the specialist protection of units operating in extreme environments such as military, aerospace and automotive electronics. It is an ultra-high performance resin, offering excellent characteristics as well as toughness and tear resistance.
UR5123 is thixotropic allowing the resin flow to be controlled and for more accurate placement. It is designed not to flow through small diameter (1-2mm) holes in PCB's and casings. It also has a low moisture sensitivity allowing for excellent surface cure. Once cured it has very good adhesion to most substrates, and it maintains flexibility to protect delicate components even to temperatures as low as -60°C, while its upper operating temperature is 130°C.
UR5123 is also an ideal choice for marine applications where the electronics will be exposed to fresh or sea water, or even completely submerged as it has a low water absorption and high resistance to water.