Electrolube silicone resins are specialist systems for the potting and encapsulation of printed circuit boards (PCBs), electronic components and electronic devices. Resin systems are designed to insulate the device from harsh environments acting as a barrier against contaminates such as moisture, chemicals and to protect against physical shock and vibrations.More info > Download product selector chart > Download product brochure >
Electrolube Silicone resins are formulated specifically to exhibit the most desirable characteristics for potting and encapsulating electronic devices protecting from contaminants, chemicals and the environment. Silicone resin systems are generally the most flexible of the three chemistries and display a high resistance to extreme temperatures.
The flexibility of the cured silicone resin system allows the resin to expand and contract under rapid temperature change, allowing it to perform over a very wide operating temperature range. This makes silicone resins an ideal choice for automotive, aerospace or industrial applications where operating temperatures can be extreme or undergo large fluctuations.
This flexibility also means that silicone potting compounds are usually much softer than their epoxy or polyurethane counterparts making them an ideal choice for applications that may require re-work or repair. Silicone resins have excellent adhesion to the majority of substrates, including metals and plastics.
Silicone resins have excellent adhesion to the majority of substrates, including metals and plastics. The combination of flexibility and adhesion means that silicone resins are very good at protecting the encapsulated electronics from vibration and sudden shocks.
Electrolube silicone resins perform in a wide range of applications, and our optically clear silicone resin SC3001 has seen a growing popularity as an LED encapsulant, for both indoor and outdoor applications.
Two-part, general purpose silicone potting compound.
Two-part, fast curing, silicone potting compound
Two-part, Thermally conductive thixotropic potting compound.