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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

More Information

Encapsulation Resins


ER1122 - Clear Amber Epoxy Resin

Clear Amber Epoxy Resin


Product code: ER1122K5K

ER1122 two part Epoxy encapsulation and potting compound for general purpose applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin.

The resin exhibits superior adhesion to a rage of materials, and maintains this even in harsh environments including under some chemical conditions. It also shows good electrical properties

Key Properties:
  • Excellent adhesion to a wide variety of substrates
  • Good bond strength - even in harsh conditions
  • Mix ratio can be altered to vary flexibility
  • Good electrical properties
  • Can be used as an adhesive or encapsulant
  • RoHS Compliant

Product data sheets
ER1122 (tds) Download

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