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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Epoxy

ER1450 - White / Clear Epoxy Resin

ER1450
White / Clear Epoxy Resin

250g - 5KG

Product code: ER1450RP250G - ER1450K5K

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These electronic potting and encapsulation compounds are fast curing two part epoxy resins of low viscosity. ER1450 cures as an opaque white resin, while ER1451 exhibits the same properties but has an optically clear finish.

Both resins exhibit exactly the same physical properties.

They are tough but fast curing systems which show good results through thermal cycling and offering stability in applications with variable temperature while maintaining good electrical properties and a good adhesion to a range of substrates.

The system may be supplied in bulk, kit or resin pack form.

Key Properties:
  • Excellent water resistance
  • Excellent adhesive properties
  • Good electrical properties
  • Very low viscosity
  • Wide operating temperature range (-50 °C to 130 °C)
  • Fast curing resin
  • RoHS Compliant
Product data sheets
ER1450 (tds) Download

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