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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

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Encapsulation Resins


ER2219  - Single Component Epoxy Resin

Single Component Epoxy Resin

35ml - 1Kg

Product code: ER221935SL - ER2219B1K

ER2219 is a versatile single component epoxy resin suitable for use as a glob-top resin or for dipping hybrid circuits and individual components which require discrete concealment. The resin is semi-thixotropic allowing for efficient heat curing and a faster process time.

ER2219 meets UL94 V-0 approval as a flame retardant resin.

Key Properties:
  • Single-part black epoxy
  • Semi-thixotropic epoxy;
  • Flame retardant resin
  • High ionic purity; low ionisable chlorine content
  • Quick cure at elevated temperatures;
  • Meets UL94 V-0 Approval
  • RoHS Compliant

Product data sheets

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