Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Epoxy

ER2220  - Thermally Conductive Epoxy

ER2220
Thermally Conductive Epoxy

250g Resin Pack - 5Kg

Product code: ER2220RP250G - ER2220K5K


ER2220 is a flame retardant, thermally conductive, two part encapsulation compound based on epoxy technology. Designed to meet increasing demands for efficient thermal dissipation, ER2220 combines ease of processing with an enhanced thermal conductivity when compared to traditional thermally conductive encapsulants. Combined with flame retardance achieving UL94 V-0 level, ER2220 provides the ultimate in protection and performance for avast array of applications, including those in the rapidly expanding LED industry.


Key Properties:
  • Very high thermal conductivity: 1.54 W/m.K
  • Flame Retardant
  • Utilises non-abrasive fillers
  • Used for encapsulating PCBs or devices requiring effective thermal dissipation
  • Provides environmental protection
  • Wide operating temperature range: -40°C to +130°C

Product data sheets
ER2220 (tds) Download
61-ER2220A-SDS1706 (msds) Download
61-ER2220B-SDS1703 (msds) Download