Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.More info > Download product selector chart > Download product brochure >
Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.
Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.
Example of Mixing instructions for Encapsulation Resins
Product code: ER2221RP250G - ER2221K5K
ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black, while ER2222 is a red version, otherwise the cured resins do not differ in their physical properties. Both exhibit excellent thermal resistance up to an operating temperature of 150°C and have an enhanced thermal conductivity value in comparison to other encapsulants of 1.20W/m.K.
Both resin systems are filled, but the viscosity of the mixed system is low in comparison to other resins with a similar filler loading. This allows the mixed resin to be easily mixed and can flow between components and devices with limited spacing.
ER2221 is an excellent choice for encapsulating an electronic device which requires high levels of thermal resistance and protection such as automotive, aerospace, industrial or other applications which are subject to harsh environments.
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