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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.


Example of Mixing instructions for Encapsulation Resins


More Information

Encapsulation Resins

Epoxy

ER2224 - Thermally Conductive Resin

ER2224
Thermally Conductive Resin

250G - 5Kg

Product code: ER2224RP250G - ER2224K5K

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ER2224 Epoxy potting compound is a highly thermally conductive resin (1.0 W/m*K) which also offers strong thermal cycling properties. It is an off-white resin allowing it to blend with LED designs, dissipating heat from the LED and extending the units operating lifetime and reliability while offering excellent environmental protection against the elements as well as showing good chemical resistance.

It has good high temperature stability with a wide operating temperature range which makes it suitable for a wide variety of applications.

Key Properties:
  • High thermal conductivity;
  • ideal for heat dissipation within LED applications
  • Good environmental protection;
  • offers good resistance to solvents and chemicals
  • Wide operating temperature range;
  • good high temperature stability
  • Very low water absorption
  • RoHS Compliant
Product data sheets
ER2224 (tds) Download

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