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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

More Information

Encapsulation Resins

Resins Cleaners

OP9004 - Resin Machine Cleaner

Resin Machine Cleaner

5 Litre

Product code: OP9004-5L

OP9004 is a special non-flammable solvent blend designed to swell and soften cured epoxy, polyurethane and other resins and enable their removal from most substrates. OP9004 is somewhat slower in evaporation rate than OP9003 and hence is more suitable for cleaning machines by wiping.

Key Properties:
  • Highly effective resin and coating remover; ideal for cleaning equipment
  • Suitable for use on a variety of substrates; testing is advised
  • Non-flammable solvent blend with slightly longer evaporation rate than OP9003
  • Fast removal of chemically resistant conformal coatings from electronic components and PCBs

Product data sheets
OP9004 (tds) Download

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