Meeting the challenge of challenging environments
Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.
More info > Download product selector chart > Download product brochure >Product code: UR5097RP250G - UR5097K5K - UR5097K10K - UR5097K25K
This thermally conductive Polyurethane encapsulation and potting compound is a two part system with a black finish. It exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required.
The cured polyurethane is resistant to a wide or cycling temperature range making it an ideal choice for applications where thermal shock is a potential risk to the electronics, while it is also flame retardant to UL94 certification.
Its low water absorption offers exceptional protection against moisture in humid environments or water that may be present.
UR5097 (tds) | Download |
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