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Encapsulation Resins

Meeting the challenge of challenging environments

Electrolube resins in use.
  • UL approved
  • Potting / encapsulating
  • Sealing and protection
  • Cable jointing
  • Coloured and optically clear
  • Bespoke and ex-stock

Resin systems are designed to protect and insulate printed circuit boards (PCBs) and electronic components from the threats of harsh and challenging environments, including; moisture, vibration, thermal or physical shock and general contamination. By encapsulating the entire device, resins can form a complete barrier against such environments offering superior performance under extreme conditions.

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Potting and encapsulation resins also offer excellent mechanical protection. Mechanical protection can be identified in a number of ways; superior performance is evident in applications involving prolonged exposure or immersion in harsh chemicals, or those exposed to vibrational, thermal or physical shock, for example. The higher level of protection is achieved through the mass of the resin surrounding the unit. This is different for every application however potting and encapsulating resins always provide a far more substantial covering than thatoffered by conformal coatings.

Due to the bulk of material surrounding the PCB, potting and encapsulation resins are commonly two-part systems which when mixed together form a solid, fully cured material, with no by-products. In cases where the conditions are not considered extreme, Electrolube offer a range of conformal coatings which provide a combination of protection in humid and corrosive environments with ease of application. They can be used for complete coverage or selective application onto the PCB, thus minimising the weight added as a result of applying a protective material.

Example of Mixing instructions for Encapsulation Resins

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Encapsulation Resins


UR5623 - White Polyurethane Resin

White Polyurethane Resin

250G - 1000G - 5KG

Product code: UR5623RP250G - UR5623RP1000G - UR5623K5K

This two part white polyurethane potting and encapsulation compound is formulated as a high performance resin especially for electronics industry. Its a tough resin with exceptional adhesion to a wide range of substrates with UL approval for fire resistance making it an ideal choice for cable jointing applications.

It is particularly good for applications where there are stringent temperature cycling or thermal shock requirements.

Ideal for cable jointing, casting, coil impregnation, PCB encapsulation, transformers, alarms and battery terminations

Key Properties:
  • Semi-rigid polyurethane resin with exceptional toughness
  • Excellent adhesion and chemical resistance
  • Low viscosity mixed system - makes for easy application
  • Flame retardant, Meets UL94 V-0
  • RoHS Compliant

Product data sheets
UR5623 (tds) Download

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