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Thermal Bonding Materials

Created to perform when the heat is on

Thermal Bonding Materials
  • RTV’s / two parts available
  • Syringe / cartridge application
  • Variety of bond strengths
  • High thermal conductivity

Thermally conductive adhesives can be used as interface materials either for thermal conductivity alone or to secure the heat sink or electronic component in place. In addition, such curing materials can be used for filling small gaps and providing some structural support to larger components.

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Thermal bonding materials are a thermal interface material with an adhesive element in order to offer structural support of electronic components while allowing efficient dissipation of heat.

There are a range of applications that may require thermally conductive bonding materials such as the application of a heatsink or to apply localised heat dissipation or structural stability to delicate electronic components such as LEDs. Thermal bonding materials may also be used as sealant around components in order to ensure efficient thermal dissipation to the heatsink or coolant device.

Electrolube products vary in their application method, cure type and bond strength and can be used in a wide variety of applications.

As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Thermal Bonding Materials

TBS  - Thermal Bonding System

Thermal Bonding System

20ml syringe

Product code: TBS20S

Thermal Bonding Compound is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating. It is especially useful in the manufacture of heatsink assemblies where 'piggy back' arrangements are applied and where the manufacture design of heat sinks does not allow for welding or brazing techniques to be employed due to complexity or geometry of the fins. TBS is also ideal for use as a bonding medium in surface mounting assemblies.

Key Properties:
  • Two part epoxy bonding system
  • Very high bond strength
  • High thermal conductivity: 1.10 W/m.K
  • Eliminates need for mechanical fixing by providing a permanent bond
  • Wide operating temperature range: -40°C to +120°C
  • Includes glass beads for a set thickness to be applied

Product data sheets
TBS (tds) Download

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