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Thermal Bonding Materials

Created to perform when the heat is on

Thermal Bonding Materials
  • RTV’s / two parts available
  • Syringe / cartridge application
  • Variety of bond strengths
  • High thermal conductivity

Thermally conductive adhesives can be used as interface materials either for thermal conductivity alone or to secure the heat sink or electronic component in place. In addition, such curing materials can be used for filling small gaps and providing some structural support to larger components.

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Thermal bonding materials are a thermal interface material with an adhesive element in order to offer structural support of electronic components while allowing efficient dissipation of heat.

There are a range of applications that may require thermally conductive bonding materials such as the application of a heatsink or to apply localised heat dissipation or structural stability to delicate electronic components such as LEDs. Thermal bonding materials may also be used as sealant around components in order to ensure efficient thermal dissipation to the heatsink or coolant device.

Electrolube products vary in their application method, cure type and bond strength and can be used in a wide variety of applications.

As with all thermal interface materials we would advise that you test any product you select thoroughly, as each application will vary from the next and figures quoted on a TDS may not match the results in the ‘real’ operating environment.

If you have any questions, please don’t hesitate to get in touch with our Technical Support Team, or alternately we have some great articles available:

Thermal Management Solutions

Thermal Bonding Materials

TCOR  - Thermally Conductive Oxime RTV

Thermally Conductive Oxime RTV


Product code: TCOR75S

Electrolube TCOR is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a wide variety of uses, particularly in automotive applications. Combining the properties of silicone rubber pads with those of a conventional heat transfer paste, TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance. It can be applied around components and power resistors to dissipate excess heat to heat sinks, avoiding any potential overheating and subsequent failures. It can be used as a low bond strength adhesive, sealant or gasketing compound.

Key Properties:
  • Single part, low odour RTV
  • Very high thermal conductivity: 1.80 W/m.
  • Exceptionally wide operating temperature range: -50°C to +230°C
  • Moisture cure - releasing oxime upon cure
  • Easy to apply - use with TCR Gun Applicator
  • Good bond strength and remains flexible at high temperatures

Product data sheets
TCOR (tds) Download

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