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Thermal Management of LEDs
- Thermal Pastes
- Phase Change Material
- Gap Pads
- Thermal Bonding
- RTVs
- Encapsulation Resins
The thermal management of the LED and the unit is a vitally important consideration for the reliability of an LED unit. A variation of just one single degree centigrade can effect both the life of the LED, (the higher the temperature the unit is running at the faster the luminaire degrades) as well as the efficiency, ( the lower the temperature, the more efficient the luminaire is at producing light).
More info >With a single degree centigrade of heat having such a large effect on the efficiency and the lifetime of an LED Luminaire, the thermal interface material chosen for the LED design is of vital importance.
Electrolube offer a wide range of thermal interface materials including curing and non-curing pastes, gap pads, phase change materials (facilitating easy rework), as well as a selection of encapsulation resins which are designed to dissipate the heat away from the components to the housing.
If you have any questions our dedicated technical support team are on hand to answer your questions and don’t forget that our LED brochure contains vast amount of collaborative test data from Bridgelux comparing data to help you select the right material.
If you would like to read in more detail about the effects of effective thermal management on LED units, we have several articles you may be interested in:
ER2183
Black Epoxy Resin
Medium viscosity, thermally conductive and flame retardant, two part encapsulating and potting compound
ER2220
Thermally Conductive Epoxy
Highly thermally conductive epoxy, flame retardant, two part encapsulation compound
ER4001
White Epoxy Resin
High temperature resistant, thermally conductive, two-part encapsulation compound based on epoxy technology
GP300
Thermal Gap Pad
Electrolubes GP300 is a silicone based thermal interface gap pad which offers easy application and high thermal conductivity.
GP500
Thermal Gap Pad
Electrolubes GP500 is a silicone based thermal interface gap pad which offers easy application and high thermal conductivity.
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP provides the ultimate in thermal conductivity
HTCX
Non-Silicone Heat Transfer Compound Xtra
Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity
HTSX
Silicone Heat Transfer Compound Xtra
silicone thermal interface material which has been developed to perform in more extreme conditions
SCTP
Surface cure thermal paste
SCTP is a thermal interface material for use where the efficient thermal coupling of electrical components is required. It is specially designed to resist pumping out from the bond line and can be applied using industrial dispensing equipment or via screen/stencil printing techniques.
TBS
Thermal Bonding System
Thermal Bonding Compound is a two part epoxy bonding system
TCOR
Thermally Conductive Oxime RTV
Electrolube TCOR is a single component, 100% solids, low odour RTV
TPM350
Thermal Phase Change Material
TPM350 is a high-performance phase-changing thermal interface material which offers easy application and high thermal conductivity
TPM550
Thermal Phase Change Material
TPM550 is a high-performance phase-changing thermal interface material which offers easy application and very high thermal conductivity.
UR5097
Black Polyurethane Resin
Flame retardant, thermally conductive, two part encapsulating and potting compound
UR5633
Black Polyurethane Resin
A flame retardant, thermally conductive resin with a wide operating temperature range and excellent water resistance.